Base material: FR-4 Copper thickness: 1.0 ounce Thickness: 1.2mm Layer count: 6 Finish: hot air leveling Minimum line width: 0.1mm Minimum line space: 0.1mm Minimum hole diameter: 0.2mm Maximum aspect ratio: 1:8 Blind/buried via: yes PTH hole diameter tolerance: ±0.075mm Board flatness tolerance: 0.5 to 1.0% Angle of V-cut: 30 degrees Dimensions: 178.00 x 189.80mm Maximum board size: (L) 500 x (W) 600mm
金峰电路(惠州)有限公司,成立于1999年,位于广东省惠州市仲恺高新区。我公司**从事双面及多层电路板的生产及销售,可以为您提供OSP,喷锡及沉金等工艺的电路板。质量**,价格实惠,欢迎垂询!