ILA1F571TB1A0 施耐德ups电源 已较新

CPU被做成产品之前被检出缺陷
这一个阶段也就是芯片tape out之后，应用到系统或者产品之前。
　　事实上，在现在的芯片设计中，在设计之初就已经为芯片的制造，测试，以及良率做考虑了。保证这一步能检测出芯片的缺陷，主要是DFT+ATE来保证。当然也有一些公司会做DFD和DFM。
　　ATE测试就是为了检查制造缺陷过程中的缺陷。芯片测试分两个阶段，一个是CP(Chip Probing)测试，也就是晶圆(Wafer)测试。另外一个是FT(Final Test)测试，也就是把芯片封装好再进行的测试。
所以在芯片被做成成品之前，每一片芯片都是经过量产测试才发货给客户的。
ILA2E571PC1A0
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ILA2P571PC1A0
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ILA2T572TB1F0

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ILA2T572TC1A0
ILA2T572TC1F0
ILA2T572TC2A0
ILE无刷直流技术
ILE1F661PB1A1
ILE1F661PC1A1
ILE1F661PB1A2
ILE1F661PC1A3
ILE2K661PC1A8
ILE2K661PC1A5
ILE2K661PC1A6
ILE2E662PC1A0
ILE1B661PC1A3
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ILE2D661PB1A0
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ILE2D661PC1A8

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ILS1R853PB1A0
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ILS1R853TC1F0
ILS1U571PB1A0
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ILS1U573PB1A0
ILS1U851PB1A0
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ILS1U853PB1A0
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ILS1V571PB1A0
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ILA1B571PC1F0
ILS1B853PC1A0
ILS2K571PC1A0
ILA1B572S1835
ILE1F661S1982
ILS1V572S1026
ILS1B571S1176
以上只是部分型号信息，如需了解更多型号参数信息，欢迎留言

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